Socket for burn-in testing of QFN semiconductor packages.
Test socket for QFN packages compatible with narrow pitch. For improving the yield of semiconductor components.
The QFN semiconductor package is essential for miniaturizing precision equipment. The Burn-In Socket 'Series 790' allows for quality testing to be conducted with higher precision and efficiency to avoid defective products. - Supports terminal pitches of 0.4, 0.5, 0.8, and 1.0 mm - Open-top type, ideal for both automatic and manual insertion/removal - Usable in harsh environmental tests such as HAST and THB - Improves positioning accuracy for fine-pitch devices These features enhance the accuracy of burn-in testing.
- Company：Boyd Technologies Japan 本社
- Price：Less than 10,000 yen
